Freescale Semiconductor, Inc.
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Max
Unit
GLOBAL ABSOLUTE MAXIMUM RATINGS
Input Power Supply Voltage
IB+ = 0 A
VB+
V
-0.3 to 36
Terminal Soldering Temperature (Note 1)
TSOLDER
260
°C
Power Dissipation (Note 2)
PD
3.0
W
ESD Standoff Voltage
Non-Operating, Unbiased, Human Body Model (Note 3)
VESD1
V
±2000
Thermal Resistance
Junction-to-Ambient (Note 4)
Junction-to-Ambient (Note 2)
Junction-to-Case
RθJA
RθJA
RθJC
°C/W
45
25
2.0
GLOBAL OPERATING RATINGS
Operating Ambient Temperature
TA
0 to 85
°C
Operating Device Junction Temperature
TJ
105
°C
Input Power Supply Voltage
IB+ = 0 A to 3.0 A
VB+
V
12 to 32
Quiescent Bias Current from B+ (Note 5)
VB+ = 12 V to 32 V
IB+(q)
mA
7.5
Operating Junction Temperature
TJ
-0 to 105
°C
VI/O SWITCHING REGULATOR (Note 6)
Maximum Output Voltage Startup Overshoot (COUT = 330 µF)
VI / O(STARTUP)
V
MODE0 = 0
5.4
MODE0 = Open
3.6
Maximum Output Current
TA = 0°C to 105°C
IVI/O
A
1.2
Notes
1. Soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause
malfunction or permanent damage to the device.
2. With 2.0 in2 of copper headsink.
3. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω).
4. With no additional heatsinking.
5. Maximum quiescent power dissipation is 0.25 W.
6. 12 V ≤ VB+ ≤ 32 V and -20°C ≤ TJ ≤ 145°C unless otherwise noted.
34710
4
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