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MC33363B
ON-Semiconductor
ON Semiconductor ON-Semiconductor
MC33363B Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
MC33363B
High Voltage Switching
Regulator
The MC33363B is a monolithic high voltage switching regulator
that is specifically designed to operate from a rectified 240 Vac line
source. This integrated circuit features an on--chip 700 V/1.0 A
SENSEFETpower switch, 500 V active off--line startup FET, duty
cycle controlled oscillator, current limiting comparator with a
programmable threshold and leading edge blanking, latching pulse
width modulator for double pulse suppression, high gain error
amplifier, and a trimmed internal bandgap reference. Protective
features include cycle--by--cycle current limiting, input undervoltage
lockout with hysteresis, overvoltage protection, and thermal
shutdown. This device is available in a 16--lead dual--in--line and wide
body surface mount packages.
Features
On--Chip 700 V, 1.0 A SENSEFET Power Switch
Rectified 240 Vac Line Source Operation
On--Chip 500 V Active Off--Line Startup FET
Latching PWM for Double Pulse Suppression
Cycle--By--Cycle Current Limiting
Input Undervoltage Lockout with Hysteresis
Over--Voltage Protection
Trimmed Internal Bandgap Reference
Internal Thermal Shutdown
These are Pb--Free Devices*
http://onsemi.com
MARKING
DIAGRAMS
16
1
SO--16WB
DW SUFFIX
CASE 751N
MC33363BDW
AWLYYWWG
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G = Pb--Free Package
PIN CONNECTIONS
Startup Input 1
16
Power Switch
Drain
AC Input
Regulator
Output
8
6
RT
CT 7
Mirror
Osc
PWM
Thermal
Startup Input 1
Startup
Reg
PWM Latch
S
Driver
Q
R
UVLO
OVP
VCC
3
Overvoltage
Protection
Input
11
16
Power Switch
Drain
LEB
Ipk
Compensation
9
DC Output
VCC 3
4
GND
5
RT 6
CT 7
Regulator Output 8
13
GND
12
11
Overvoltage
Protection Input
10
Voltage Feedback
Input
9 Compensation
(Top View)
ORDERING INFORMATION
Device
Package
Shipping
MC33363BDWG
SO--16WB
(Pb--Free)
47 Units/Rail
MC33363BDWR2G SO--16WB 1000 Tape & Reel
(Pb--Free)
EA
10
GND 4, 5, 12, 13
Voltage
Feedback
Input
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Figure 1. Simplified Application
*For additional information on our Pb--Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2010
1
November, 2010 -- Rev. 9
Publication Order Number:
MC33363B/D

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