MC10H332(2000) 데이터 시트보기 (PDF) - ON Semiconductor
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MC10H332 Datasheet PDF : 8 Pages
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20
1
A
F
H
D
SEATING
PLANE
–A–
20
1
–T–
SEATING
PLANE
E
G
F
MC10H332
11
10
B
PACKAGE DIMENSIONS
CDIP–20
L SUFFIX
CERAMIC DIP PACKAGE
CASE 732–03
ISSUE E
C
L
N
K
G
J
M
NOTES:
1. LEADS WITHIN 0.010 DIAMETER, TRUE
POSITION AT SEATING PLANE, AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONS A AND B INCLUDE MENISCUS.
INCHES
DIM MIN MAX
A 0.940 0.990
B 0.260 0.295
C 0.150 0.200
D 0.015 0.022
F 0.055 0.065
G 0.100 BSC
H 0.020 0.050
J 0.008 0.012
K 0.125 0.160
L 0.300 BSC
M
0_ 15_
N 0.010 0.040
PDIP–20
P SUFFIX
PLASTIC DIP PACKAGE
CASE 738–03
ISSUE E
11
B
10
C
L
K
N
D 20 PL
0.25 (0.010) M T A M
M
J 20 PL
0.25 (0.010) M
TBM
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 1.010 1.070 25.66 27.17
B 0.240 0.260 6.10 6.60
C 0.150 0.180 3.81 4.57
D 0.015 0.022 0.39 0.55
E
0.050 BSC
1.27 BSC
F 0.050 0.070 1.27 1.77
G 0.100 BSC
2.54 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.140 2.80 3.55
L
0.300 BSC
7.62 BSC
M 0_ 15_ 0_ 15_
N 0.020 0.040 0.51 1.01
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