MBRB20100CD 데이터 시트보기 (PDF) - Motorola => Freescale
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MBRB20100CD Datasheet PDF : 6 Pages
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MBRB20100CT
INFORMATION FOR USING THE D2PAK SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must be
the correct size to insure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self align when subjected to a
solder reflow process.
0.74
18.79
0.420
10.66
0.330
8.38
0.065
1.651
0.07
1.78
0.14
3.56
inches
mm
D2PAK POWER DISSIPATION
The power dissipation of the D2PAK is a function of the drain
pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power dissipation.
Power dissipation for a surface mount device is determined by
TJ(max), the maximum rated junction temperature of the die,
RθJA, the thermal resistance from the device junction to
ambient; and the operating temperature, TA. Using the values
provided on the data sheet for the D2PAK package, PD can be
calculated as follows:
PD =
TJ(max) – TA
RθJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature TA of 25°C, one can
calculate the power dissipation of the device which in this case
is 2.5 watts.
The 50°C/W for the D2PAK package assumes the use of the
recommended footprint on a glass epoxy printed circuit board
to achieve a power dissipation of 2.5 watts. There are other
alternatives to achieving higher power dissipation from the
D2PAK package. One is to increase the area of the drain pad.
By increasing the area of the drain pad, the power dissipation
can be increased. Although one can almost double the power
dissipation with this method, one will be giving up area on the
printed circuit board which can defeat the purpose of using
surface mount technology.
Another alternative would be to use a ceramic substrate or
an aluminum core board such as Thermal Clad™. Using a
board material such as Thermal Clad, an aluminum core
board, the power dissipation can be doubled using the same
footprint.
PD = 150°C – 25°C = 2.5 watts
50°C/W
Rectifier Device Data
3
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