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MAX9830 데이터 시트보기 (PDF) - Maxim Integrated

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MAX9830
MaximIC
Maxim Integrated MaximIC
MAX9830 Datasheet PDF : 12 Pages
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Mono 2W Class D Amplifier
Applications Information
Filterless Class D Operation
Traditional Class D amplifiers require an output filter.
The filter adds cost, size, and decreases efficiency and
THD+N performance. The MAX9830’s filterless modula-
tion scheme does not require an output filter.
Because the switching frequency of the MAX9830 is
well beyond the bandwidth of most speakers, voice coil
movement at the switching frequency is very small. Use
a speaker with a series inductance > 10µH. Typical 8
speakers exhibit series inductances in the 20µH to
100µH range.
Component Selection
Optional Ferrite Bead Filter
Although not normally needed, in applications where
speaker leads exceed 24in at VPVDD = 3V, use a filter
constructed from an inexpensive ferrite bead and a
small-value capacitor to ground (Figure 2) to provide
additional EMI suppression. Use a ferrite bead with low
DC resistance, high frequency (1MHz) impedance of
100to 600, and rated for at least 1A. The capacitor
value varies based on the ferrite bead chosen and the
actual speaker lead length. Select the capacitor value
based on EMI performance.
Speaker Amplifier Power Supply Input (PVDD)
PVDD powers the speaker amplifier. PVDD ranges from
2.6V to 5.5V. Bypass PVDD with a 0.1µF capacitor to
PGND. Apply additional bulk capacitance at the device
if long input traces between PVDD and the power
source are used. Ensure a rate of voltage rise at PVDD
is limited to 1V/µs.
MAX9830
OUT+
OUT-
Figure 2. Optional Ferrite Bead Filter
Input Filtering
The input-coupling capacitor (CIN), in conjunction with
the amplifier’s internal input resistance (RIN), forms a
highpass filter that removes the DC bias from the
incoming signal. These capacitors allow the amplifier to
bias the signal to an optimum DC level. Select 0.47µF
capacitors for optimum click-and-pop performance and
17Hz f-3dB.
If a different f-3dB is required, CIN, assuming zero-
source-impedance, is:
CIN
=
8
f -3dB
[µF]
Use capacitors with adequately low voltage-coefficient
for best low-frequency THD performance.
Layout and Grounding
Proper layout and grounding are essential for optimum
performance. Good grounding improves audio perfor-
mance and prevents switching noise from coupling into
the audio signal.
Use wide, low-resistance output traces. As load imped-
ance decreases, the current drawn from the device out-
puts increase. At higher current, the resistance of the
output traces decrease the power delivered to the load.
For example, if 2W is delivered from the speaker output
to a 4load through a 100mtrace, 49mW is con-
sumed in the trace. If power is delivered through a
10mtrace, only 5mW is consumed in the trace. Wide
output, supply and ground traces also improve the
power dissipation of the device.
The MAX9830 is inherently designed for excellent RF
immunity. For best performance, add ground fills
around all signal traces on top and bottom PCB planes.
The MAX9830 TDFN package features an exposed
thermal pad on its underside. This pad lowers the pack-
age’s thermal resistance by providing a heat conduc-
tion path from the die to the PCB. Connect the exposed
thermal pad to the ground plane by using a large pad
and multiple vias.
PROCESS: CMOS
Chip Information
8 _______________________________________________________________________________________

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