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MAX9737

Mono 7W Class D Amplifier

Maxim Integrated 

Mono 7W Class D Amplifier

ABSOLUTE MAXIMUM RATINGS

PVDD to PGND.......................................................-0.3V to +30V

AGND to PGND .....................................................-0.3V to +0.3V

IN, PRE, PC, COM to AGND.....................-0.3V to (VREG + 0.3V)

MUTE, SHDN to AGND ............................................-0.3V to +6V

REG to AGND ...............................................-0.3V to (VS + 0.3V)

VS to AGND ..............................................................-0.3V to +6V

OUT+, OUT- to PGND .............................-0.3V to (PVDD + 0.3V)

C1N to PGND ..........................................-0.3V to (PVDD + 0.3V)

C1P to PGND .........................(PVDD - 0.3V) to (VCHOLD + 0.3V)

CHOLD to PGND .......................................(VC1P - 0.3V) to +36V

OUT+, OUT-, Short Circuit to PGND or PVDD ...........Continuous

Thermal Limits (Notes 1, 2)

Continuous Power Dissipation (TA = +70°C)

24-Pin TQFN Single-Layer PCB (derate 20.8mW/°C

above +70°C)........................................................1666.7mW

θJA ................................................................................48°C/W

θJC..................................................................................3°C/W

Continuous Power Dissipation

24-Pin TQFN Multiple-Layer PCB

(derate 27.8mW/°C above +70°C) ........................2222.2mW

θJA ................................................................................36°C/W

θJC..................................................................................3°C/W

Operating Temperature Range ...........................-40°C to +85°C

Storage Temperature Range .............................-65°C to +150°C

Junction Temperature ......................................................+150°C

Lead Temperature (soldering, 10s) .................................+300°C

Note 1: Thermal performance of this device is highly dependent on PCB layout. See the Applications Information section for more detail.

Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

ELECTRICAL CHARACTERISTICS

(VPVDD = 12V, VAGND = VPGND = 0, VSHDN = VMUTE = 5V, C1 = 0.1µF, CIN = 0.47µF, C2 = CCOM = CREG = 1µF, RIN = RFB = 20kΩ,

RL = ∞, AC measurement bandwidth 22Hz to 22kHz, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.)

(Note 3)

PARAMETER

SYMBOL

AMPLIFIER DC CHARACTERISTICS

Speaker-Supply Voltage Range

PVDD

Undervoltage Lockout

UVLO

Quiescent Supply Current

IPVDD

CONDITIONS

Inferred from PSRR test

TA = +25°C

Shutdown Supply Current

ISHDN

REG Voltage

VREG

Preregulator Voltage

COM Voltage

VS

VCOM

INPUT AMPLIFIER CHARACTERISTICS

Capacitive Drive

CL

Output Swing

Open-Loop Gain

AVO

Input Offset Voltage

VOS

Input Amplifier Slew Rate

VSHDN = 0, TA = +25°C

No sustained oscillation

Sinking ±1mA (Note 4)

IN to COM

MIN TYP MAX UNITS

8

28

V

6.8

V

15

20

mA

25

1

10

µA

4.0

4.2

4.5

V

4.85

V

1.94 2.06 2.16

V

30

pF

2.05

V

88

dB

±2

mV

2.5

V/µs

Input Amplifier Unity-Gain

Bandwidth

3.5

MHz

2 _______________________________________________________________________________________

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