MAX6409BS34-T 데이터 시트보기 (PDF) - Maxim Integrated
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MAX6409BS34-T Datasheet PDF : 8 Pages
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Voltage Detectors in 4-Bump (2 X 2)
Chip-Scale Package
VIN
DC/DC
VOUT
CONVERTER
REGULATED 3.0V
VCC
3.6V
Li+
µP
VCC
MAX6408/
OUT
MAX6411
SUSPEND
MR (OPEN-DRAIN)
GND
Figure 1. Interfacing to Different Logic Voltage Components
Negative-Going VCC Transients
These devices are relatively immune to short-duration,
negative-going VCC transients (glitches).
The Typical Operating Characteristics show the
Maximum Transient Duration vs. Threshold Overdrive
graph, for which output pulses are not generated. The
graph shows the maximum pulse width that a negative-
going VCC transient may typically have before the
devices issue output signals. As the amplitude of the
transient increases, the maximum allowable pulse width
decreases.
UCSP Reliability
The chip-scale package (UCSP) represents a unique
packaging form factor that may not perform equally to a
packaged product through traditional mechanical reliabil-
ity tests. CSP reliability is integrally linked to the user’s
assembly methods, circuit board material, and usage
environment. The user should closely review these areas
when considering use of a CSP package. Performance
through Operating Life Test and Moisture Resistance
remains uncompromised as it is primarily determined by
the wafer-fabrication process.
Mechanical stress performance is a greater considera-
tion for a CSP package. CSPs are attached through
direct solder contact to the user’s PC board, foregoing
the inherent stress relief of a packaged product lead
frame. Solder joint contact integrity must be considered.
Information on Maxim’s qualification plan, test data, and
usage recommendations are detailed in the UCSP appli-
cation note, which can be found on Maxim’s website at
www.maxim-ic.com.
Chip Information
TRANSISTOR COUNT: 512
PROCESS: BiCMOS
Pin Configuration
TOP VIEW AFTER ASSEMBLED ON PC BOARD (BUMPS AT THE BOTTOM)
MAX6406-
MAX6411
GND
VCC
A1
A2
45 MIL
OUT (OUT)
MR
B1
B2
( ) ARE FOR MAX6407/MAX6410
45 MIL
UCSP
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