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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

MAS1175 데이터 시트보기 (PDF) - Micro Analog systems

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MAS1175
MAS
Micro Analog systems MAS
MAS1175 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
SOLDERING INFORMATION
N For Sn/Pb MSOP-10
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Seating Plane Co-planarity
Lead Finish
DA1175.008
13 July, 2006
According to RSH test IEC 68-2-58/20 2*220°C
240°C
3
Thermal profile parameters stated in JESD22-A113 should not
be exceeded. http://www.jedec.org
max 0.08 mm
Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%
N For Pb Free, RoHS Compliant MSOP-10
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Lead Finish
According to RSH test IEC 68-2-58/20
260°C
3
Thermal profile parameters stated in IPC/JEDEC J-STD-020
should not be exceeded. http://www.jedec.org
Solder plate 7.62 - 25.4 µm, material Matte Tin
6 (9)

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