MAAPGM0038-DIE 데이터 시트보기 (PDF) - Tyco Electronics
부품명
상세내역
일치하는 목록
MAAPGM0038-DIE Datasheet PDF : 6 Pages
| |||
1.2W C/Ku-Band Power Amplifier
RO-P-DS-3022 - - 5/6
MAAPGM0038-DIE
Mechanical Information
Chip Size: 2.980 x 2.980 x 0.075 mm (117 x 117 x 3 mils)
2.980mm.
2.828mm.
2.828mm.
1.490mm.
1.490mm.
0.152mm.
0
0
0.152mm.
Figure 5. Die Layout
Chip edge to bond pad dimensions are shown to the center of the bond pad.
Bond Pad Dimensions
Pad
RF In and Out
DC Drain Supply Voltage VDD
DC Gate Supply Voltage VGG
Size (µm)
100 x 200
200 x 150
150 x 150
Size (mils)
4x8
8x6
6x6
Specifications subject to change without notice.
Customer Service: Tel. (888)-563-3949
Email: macom_adbu_ics@tycoelectronics.com
North America: Tel. (800) 366-2266
Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
Visit www.macom.com for additional data sheets and product informVat1io.0n0.
Share Link: 