MAAP-000078-SMB004 데이터 시트보기 (PDF) - Tyco Electronics
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MAAP-000078-SMB004 Datasheet PDF : 8 Pages
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Amplifier, Power, 12W
2.0-6.0 GHz
Mechanical Information
MAAP-000078-PED000
Rev —
Preliminary Datasheet
Chip edge to bond pad dimensions are shown to the center of the bond pad.
Bond Pad Dimensions
Figure 17. Die Layout
Pad
Pad No.
RF In and Out
1
DC Drain Supply Voltage VD1
2
DC Drain Supply Voltage VD2
3
DC Gate Supply Voltage VG1
4
DC Gate Supply Voltage VG2
5
6
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
Size (μm)
100 x 200
200 x 150
500 x 200
150 x 150
150 x 125
Size (mils)
4x8
8x6
20 x 8
6x6
6x5
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
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