LTC3528-2 데이터 시트보기 (PDF) - Linear Technology
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LTC3528-2 Datasheet PDF : 18 Pages
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LTC3528-2
ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at TA = 25°C (Note 2). VIN = 1.2V, VOUT = 3.3V, unless otherwise noted.
PARAMETER
CONDITIONS
MIN TYP MAX UNITS
Minimum Duty Cycle
VFB = 1.3V
l
0
%
Frequency
l 1.8
2.0
2.4
MHz
SHDN Input High Voltage
0.88
V
SHDN Input Low Voltage
0.25
V
SHDN Input Current
PGOOD Threshold Percentage
VSHDN = 1.2V
Referenced to Feedback Voltage Falling
0.3
1
µA
–7
–10
–13
%
PGOOD Low Voltage
PGOOD Leakage Current
IPGOOD = 1mA
VOUT = 1.6V, IPGOOD = 1mA
VPGOOD = 5.5V
0.05
0.1
V
0.05
0.2
V
0.01
1
µA
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC3528-2 is tested under pulsed load conditions such that
TJ ≈ TA. The LTC3528E-2 is guaranteed to meet specifications from 0°C to
85°C junction temperature. Specifications over –40°C to 125°C operating
junction temperature range are assured by design, characterization and
correlation with statistical process controls. Note that the maximum
ambient temperature consistent with these specifications is determined by
specific operating conditions in conjunction with board layout, the rated
package thermal impedance and other environmental factors. The junction
temperature (TJ, in °C) is calculated from the ambient temperature (TA, in
°C) and power dissipation (PD, in Watts) according to the formula:
TJ = TA + (PD • qJA)
where qJA = 76°C/W is the package thermal impedance.
Note 3: Specification is guaranteed by design and not 100% tested in
production.
Note 4: Current measurements are made when the output is not switching.
Note 5: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed 125°C when overtemperature protection is active.
Continuous operation above the specified maximum operating junction
temperature may result in device degradation or failure.
Note 6: Failure to solder the exposed backside of the package to the PC
board ground plane will result in a thermal resistance much higher than
76°C/W.
Note 7: The IC is tested in a feedback loop to make the measurement.
TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C unless otherwise noted)
Efficiency vs Load Current
and VIN for VOUT = 1.8V
100
1000
90 EFFICIENCY
80
100
70
60
10
50
POWER
LOSS
40
1
30
20
10
0
0.01
VIN = 1V 0.1
VIN = 1.2V
VIN = 1.5V
0.01
0.1
1
10 100 1000
LOAD CURRENT (mA)
35282 G01
Efficiency vs Load Current
and VIN for VOUT = 3V
100
EFFICIENCY
90
1000
80
100
70
60
10
50
POWER
LOSS
40
1
30
20
10
0
0.01
VIN = 1V 0.1
VIN = 1.5V
VIN = 2.4V
0.01
0.1
1
10 100 1000
LOAD CURRENT (mA)
35282 G26
35282fb
3
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