LT3463 데이터 시트보기 (PDF) - Linear Technology
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LT3463 Datasheet PDF : 8 Pages
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TYPICAL APPLICATIO
VIN
2.7V
TO 5V C1
1µF
LT3463/LT3463A
Dual Output ±20V Converter
L1
10µH
3
21
VIN
9
SHDN1
SW1 VOUT1
10
FB1
LT3463 VREF 7
8
SHDN2
6
FB2
GND SW2 D2
11
4
5
L2
10µH
C4
0.1µF
D1
R2
1M
R1
66.5k
R3
61.9k
R4
1M
C3
0.47µF
VOUT1
20V
9mA
C2
0.47µF
VOUT2
–20V
9mA
3463 TA02
PACKAGE DESCRIPTIO
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
0.675 ±0.05
R = 0.115
TYP
6
0.38 ± 0.10
10
3.50 ±0.05
1.65 ±0.05
2.15 ±0.05 (2 SIDES)
PIN 1
PACKAGE TOP MARK
OUTLINE (SEE NOTE 6)
0.25 ± 0.05
0.50
BSC
2.38 ±0.05
(2 SIDES)
0.200 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
3.00 ±0.10 1.65 ± 0.10
(4 SIDES) (2 SIDES)
0.75 ±0.05
0.00 – 0.05
(DD10) DFN 1103
5
1
0.25 ± 0.05
0.50 BSC
2.38 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3463f
7
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