LT3460 데이터 시트보기 (PDF) - Linear Technology
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LT3460 Datasheet PDF : 12 Pages
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PACKAGE DESCRIPTION
0.47
0.65
MAX
REF
SC6 Package
6-Lead Plastic SC70
(Reference LTC DWG # 05-08-1638)
1.16 REF
LT3460/LT3460-1
1.80 – 2.20
(NOTE 4)
3.26 MAX 2.1 REF
0.96 MIN
1.80 – 2.40 1.15 – 1.35
(NOTE 4)
INDEX AREA
(NOTE 6)
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.10 – 0.40
PIN 1
0.65 BSC
0.80 – 1.00
1.00 MAX
0.15 – 0.30
6 PLCS (NOTE 3)
0.00 – 0.10
REF
0.10 – 0.30
0.10 – 0.18
NOTE:
(NOTE 3)
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. DETAILS OF THE PIN 1 INDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE INDEX AREA
7. EIAJ PACKAGE REFERENCE IS EIAJ SC-70
SC6 SC70 0802
DC Package
6-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1703)
0.675 ±0.05
R = 0.115
TYP
0.56 ± 0.05
4
(2 SIDES)
0.38 ± 0.05
6
2.50 ±0.05
1.15
±0.05
0.61 ±0.05
(2 SIDES)
PACKAGE PIN 1 BAR
OUTLINE TOP MARK
(SEE NOTE 6)
0.25 ± 0.05
0.50 BSC
1.42 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.200 REF
2.00 ±0.10
(4 SIDES)
0.75 ±0.05
0.00 – 0.05
PIN 1
CHAMFER OF
EXPOSED PAD
3
1
(DC6) DFN 1103
0.25 ± 0.05
0.50 BSC
1.37 ±0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WCCD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3460fb
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