LIS2L02AL 데이터 시트보기 (PDF) - STMicroelectronics
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LIS2L02AL Datasheet PDF : 17 Pages
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LIS2L02AL
6
Package Information
Package Information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 15. LGA-8 Mechanical Data & Package Dimensions
DIM.
A1
A2
A3
D1
E1
L
L1
M
M1
N
N1
N2
P1
P2
T1
T2
R
h
k
j
mm
inch
MIN. TYP. MAX. MIN. TYP. MAX.
1.460 1.520 1.600 0.0574 0.0598 0.0629
1.330
0.0523
0.180 0.220 0.260 0.007 0.0086 0.0102
4.850 5.000 5.150 0.190 0.1968 0.2027
4.850 5.000 5.150 0.190 0.1968 0.2027
1.270
0.05
2.540
0.1
1.225
0.0482
0.875 0.900 0.925 0.0344 0.0354 0.0364
2.000
0.0787
1.225
0.0482
1.170
0.046
1.300 1.350 1.400 0.0511 0.0531 0.0551
0.740 0.790 0.840 0.0291 0.0311 0.033
1.170
0.046
0.615 0.640 0.665 0.0242 0.0251 0.0261
1.200
1.600 0.0472
0.0629
0.150
0.0059
0.050
0.0019
0.100
0.0039
OUTLINE AND
MECHANICAL DATA
LGA8 (5x5x1.6mm)
Land Grid Array Package
E1
A
K
(4x)
D
KE
A3
KC
R
E
M M1
T1
8
7
1
D
6
2
5
3
4
B
E
P1
DETAIL A
A2
A1
h CA B
seating plane
K
Detail A
SOLDER MASK
OPENING
METAL PAD
j CAB
7669231 C
15/17
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