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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

KSH13009L 데이터 시트보기 (PDF) - Semihow

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KSH13009L Datasheet PDF : 7 Pages
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Reliability Qualification ( Continued )
D. High Temperature Storage Life ( HTSL )
The purpose of this test is to expose time/temperature failure mechanisms and to evaluate
long-term strong stability.
Conditions: JESD22-A103, JIS C 7021 B-10
TA=Tstg(max)
Sample Size
45
#of Fail
0
Cum. Fail%
0.0%
168hrs
0
300hrs
0
E. Temperature Cycle Air-to Air ( TMCL )
The purpose of this test is to evaluate the ability of the device to withstand both exposure to
extreme temperature and the transition between temperature extreme, and to exposure excessive
thermal mismatch between materials.
Conditions: JESD22-A104, JIS C 7021 A-4
Air to air, -65℃~150℃, 15 minutes dwell time at each temperature
Sample Size
45
#of Fail
0
Cum. Fail%
0.0%
100cycles
0
200cycles
0
◎ SEMIHOW REV.A0,May 2003

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