ISL97671 데이터 시트보기 (PDF) - Intersil
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ISL97671 Datasheet PDF : 28 Pages
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ISL97671
Absolute Maximum Ratings (TA = +25°C)
VIN, EN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 28V
FAULT . . . . . . . . . . . . . . . . . . . . . . . VIN-8.5V to VIN+0.3V
VDC, COMP, RSET. . . . . . . . . . . . . . . . . . . . . -0.3V to 5.5V
SMBCLK/SCL*, SMBDAT/SDA*, FPWM, PWM . . -0.3V to 5.5V
EN, OVP . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 5.5V
CH0 - CH5, LX . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 45V
PGND, AGND . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +0.3V
Above voltage ratings are all with respect to AGND pin
ESD Rating
Human Body Model (Tested per JESD22-A114E) . . . . . 3kV
Machine Model (Tested per JESD22-A115-A) . . . . . . . 300V
Charged Device Model . . . . . . . . . . . . . . . . . . . . . . . 1kV
Thermal Information
Thermal Resistance (Typical)
θJA (°C/W) θJC (°C/W)
20 Ld QFN Package (Notes 4, 5, 7). 40
2.5
Thermal Characterization (Typical)
PSIJT (°C/W)
20 Ld QFN Package (Note 6) . . . . . . . . . . . .
1
Maximum Continuous Junction Temperature . . . . . . +125°C
Storage Temperature . . . . . . . . . . . . . . . -65°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . -40°C to +85°C
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless
otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTES:
4. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach”
features. See Tech Brief TB379.
5. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
6. PSIJT is the PSI junction-to-top thermal characterization parameter. If the package top temperature can be measured with this
rating then the die junction temperature can be estimated more accurately than the θJC and θJC thermal resistance ratings.
7. Refer to JESD51-7 high effective thermal conductivity board layout for proper via and plane designs.
Electrical Specifications
All specifications below are tested at TA = 25°C; VIN = 12V, EN = 5V, RSET = 20.1kΩ, unless
otherwise noted. Boldface limits apply over the operating temperature range, -40°C
to +85°C.
PARAMETER
DESCRIPTION
CONDITION
MIN
MAX
(Note 8) TYP (Note 8) UNIT
GENERAL
VIN (Note 9) Backlight Supply Voltage
≤13 LEDs per channel
4.5
(3.2V/20mA type)
26.5
V
IVIN_STBY
VOUT
VIN Shutdown Current
Output Voltage
VUVLO
Undervoltage Lockout Threshold
VUVLO_HYS Undervoltage Lockout Hysteresis
REGULATOR
4.5V < VIN ≤ 26V,
FSW = 600kHz
8.55V < VIN ≤ 26V,
FSW = 1.2MHz
4.5V < VIN ≤ 8.55V,
FSW = 1.2MHz
10
µA
45
V
45
V
VIN/0.19 V
2.6
3.3
V
275
mV
VDC
IVDC_STBY
IVDC
VLDO
ENLow
LDO Output Voltage
Standby Current
VIN ≥ 6V
EN = 0V
Active Current
EN = 5V
VDC LDO Droop Voltage
VIN > 5.5V, 20mA
Guaranteed Range for EN Input Low Voltage
4.55 4.8
5
V
5
µA
5
mA
20
200
mV
0.5
V
ENHi
Guaranteed Range for EN Input High Voltage
1.8
V
5
FN7631.0
June 24, 2010
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