IRF6633
Absolute Maximum Ratings
PD @TA = 25°C
PD @TA = 70°C
PD @TC = 25°C
e Power Dissipation
e Power Dissipation
f Power Dissipation
Parameter
TP
Peak Soldering Temperature
TJ
Operating Junction and
TSTG
Storage Temperature Range
Thermal Resistance
Parameter
RθJA
el Junction-to-Ambient
RθJA
jl Junction-to-Ambient
RθJA
kl Junction-to-Ambient
RθJC
fl Junction-to-Case
RθJ-PCB
Junction-to-PCB Mounted
eà Linear Derating Factor
100
Max.
2.3
1.5
42
270
-40 to + 150
Typ.
–––
12.5
20
–––
1.0
0.018
Max.
55
–––
–––
3.0
–––
Units
W
°C
Units
°C/W
W/°C
D = 0.50
10
1
0.1
0.01
1E-006
0.20
0.10
0.05
0.02
0.01
SINGLE PULSE
( THERMAL RESPONSE )
R1R1
R2R2
R3R3
R4R4
R5R5
Ri (°C/W) τi (sec)
τJ τJ
τCτ 0.6676 0.000066
τ1 τ1
τ2 τ2
τ3 τ3
τ4 τ4
τ5 τ5
1.0462 0.000896
Ci= τi/Ri
1.5611 0.004386
Ci= τi/Ri
29.282 0.68618
25.455 32
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
1E-005
0.0001
0.001
0.01
0.1
1
10
100
t1 , Rectangular Pulse Duration (sec)
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
Notes:
Used double sided cooling, mounting pad with large heatsink.
Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
Rθ is measured at TJ of approximately 90°C.
Surface mounted on 1 in. square Cu
(still air).
www.irf.com
Mounted to a PCB with
small clip heatsink (still air)
Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
3