IR2170 데이터 시트보기 (PDF) - International Rectifier
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IR2170 Datasheet PDF : 5 Pages
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IR2170(S)
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage
parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal
resistance and power dissipation ratings are measured under board mounted and still air conditions.
Symbol
VS
VBS
VCC
VIN
VOC
VIN-
dV/dt
PD
RthJA
TJ
TS
TL
Definition
High side offset voltage
High side floating supply voltage
Low side and logic fixed supply voltage
Maximum input voltage between VIN+ and VIN-
Overcurrent output voltage
VIN- input voltage (note 1)
Allowable offset voltage slew rate
Package power dissipation @ TA ≤ +25°C
8 lead SOIC
8 lead PDIP
Thermal resistance, junction to ambient
8 lead SOIC
8 lead PDIP
Junction temperature
Storage temperature
Lead temperature (soldering, 10 seconds)
Min.
-0.3
-0.3
-0.3
-5
COM -0.3
VS -5
—
—
—
—
—
—
-55
—
Max.
600
25
25
5
VCC +0.3
VB+ 0.3
50
.625
1.0
200
125
150
150
300
Units
V
V/ns
W
°C/W
°C
Note 1: Capacitors are required between VB and Vin-, and between VB and Vs pins when bootstrap power
is used. The external power supply, when used, is required between Vs and Vin-, and between VB and Vs
pins.
Recommended Operating Conditions
The output logic timing diagram is shown in figure 1. For proper operation the device should be used within the recom-
mended conditions.
Symbol
Definition
Min.
Max. Units
VB
VS
VOC
VCC
VIN
TA
High side floating supply voltage
High side floating supply offset voltage
Overcurrent output voltage
Low side and logic fixed supply voltage
Input voltage between VIN+ and VIN-
Ambient temperature
VS +13.0
VS +20
note 2
600
COM
VCC
V
9.5
20
-260
+260
mV
-40
125
°C
Note 2: Logic operation for Vs of -5 to +600V. Logic state held for Vs of -5V to -VBS. (Please refer to the Design
Tip DT97-3 for more details).
2
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