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IMX35

i.MX35 Applications Processors for Automotive Products

Freescale Semiconductor 

• Branch prediction with return stack

• Low-interrupt latency

• Instruction and data memory management units (MMUs), managed using micro TLB structures

backed by a unified main TLB

• Instruction and data L1 caches, including a non-blocking data cache with hit-under-miss

• Virtually indexed/physically addressed L1 caches

• 64-bit interface to both L1 caches

• Write buffer (bypassable)

• High-speed Advanced Micro Bus Architecture (AMBA)™ L2 interface

• Vector floating point co-processor (VFP) for 3D graphics and hardware acceleration of other

floating-point applications

• ETM™ and JTAG-based debug support

Table 3 summarizes information about the i.MX35 core.

Table 3. i.MX35 Core

Core

Acronym

Core

Name

Brief Description

Integrated Memory

Features

ARM11 or

ARM1136

ARM1136

Platform

The ARM1136™ platform consists of the ARM1136JF-S core, the ETM

real-time debug modules, a 6 × 5 multi-layer AHB crossbar switch (MAX), and

a vector floating processor (VFP).

The i.MX35 provides a high-performance ARM11 microprocessor core and

highly integrated system functions. The ARM Application Processor (AP) and

other subsystems address the needs of the personal, wireless, and portable

product market with integrated peripherals, advanced processor core, and

power management capabilities.

• 16-Kbyte

instruction cache

• 16-Kbyte data

cache

• 128-Kbyte L2

cache

• 32-Kbyte ROM

• 128-Kbyte RAM

2.5 Module Inventory

Table 4 shows an alphabetical listing of the modules in the MCIMX35. For extended descriptions of the

modules, see the MCIMX35 reference manual.

Table 4. Digital and Analog Modules

Block

Mnemonic

Block Name

Domain1

Subsystem

Brief Description

1-WIRE 1-Wire

interface

ARM

ASRC

Asynchronous SDMA

sample rate

converter

ARM1136

platform

peripherals

Connectivity

peripherals

1-Wire provides the communication line to a 1-Kbit add-only

memory. the interface can send or receive 1 bit at a time.

The ASRC is designed to convert the sampling rate of a signal

associated to an input clock into a signal associated to a different

output clock. It supports a concurrent sample rate conversion of

about –120 dB THD+N. The sample rate conversion of each

channel is associated to a pair of incoming and outgoing sampling

rates.

i.MX35 Applications Processors for Automotive Products, Rev. 6

8

Freescale Semiconductor

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