ICSSSTUAF32868BHLF 데이터 시트보기 (PDF) - Integrated Device Technology

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ICSSSTUAF32868BHLF

28-BIT CONFIGURABLE REGISTERED BUFFER FOR DDR2

Integrated Device Technology 

ICSSSTUAF32868B

28-BIT CONFIGURABLE REGISTERED BUFFER FOR DDR2

COMMERCIAL TEMPERATURE GRADE

Absolute Maximum Ratings

Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at these or any other conditions above

those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect reliability.

Item

Rating

Supply Voltage, VDD

Input Voltage Range, VI1

Output Voltage Range, VO1,2

-0.5V to 2.5V

-0.5V to VDD + 2.5V

-0.5V to VDDQ + 0.5V

Input Clamp Current, IIK

±50mA

Output Clamp Current, IOK

±50mA

Continuous Output Clamp Current, IO

±50mA

Continuous Current through each VDD or GND

±100mA

Package Thermal Impedance (θja)3

0m/s Airflow

1m/s Airflow

40.4°C/W

29.1°C/W

Storage Temperature

-65 to +150°C

1 The input and output negative voltage ratings may be exceeded if the ratings of the I/P and

O/P clamp current are observed.

2 This current will flow only when the output is in the high state level VO > VDDQ.

3 The package thermal impedance is calculated in accordance with JESD 51.

Output Buffer Characteristics

Output edge rates over recommended operating free-air temperature range

VDD = 1.8V ± 0.1V

Parameter

Min.

Max. Units

dV/dt_r

1

4

V/ns

dV/dt_f

dV/dt_Δ1

1

4

V/ns

1

V/ns

1 Difference between dV/dt_r (rising edge rate) and dV/dt_f (falling edge rate).

28-BIT CONFIGURABLE REGISTERED BUFFER FOR DDR2

10

ICSSSTUAF32868B

7102/2

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