ICP-S 데이터 시트보기 (PDF) - ROHM Semiconductor

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ICP-S

Overcurrent Protection Elements

ROHM Semiconductor 

Overcurrent Protection Elements

8. Application Circuit Example

8-1 Recommended Flow Soldering Conditions

ICP-S Technical Manual

(°C)

Preheating

300

250

200

150

120°C

100

100°C

50

25

2 minutes min.

5 minutes min.

Soldering

Natural cooling

260°C

230°C

10 seconds min. 1 minute min.

Manual soldering conditions

Soldering iron temperature: 350°C max.

Soldering time: 3 seconds max.

8-2 Recommended Reflow Soldering Conditions

(°C)

Peak temperature

230 to 260°C, 10sec Max.

250

Reflow heating temperature

200

1 to 5°C / sec

150

100

50

Preheating

speed

0

1 to 5°C / sec

Preheating

120 to 160°C,

50 to 120 sec

∗ Number of reflow times: 2 TIMES Max.

Reflow soldering

(High-temperature

retention time)

200°C,

30 to 60 sec

Cooling

60sec Min.

A peak temperature of at least 230°C is recommended. If the peak temperature is less than 230°C, it is recommended to

make some adjustments, such as the retention of the peak temperature and soldering time longer and an increase in the thickness

of solder paste.

8-3 Recommended Copper Pattern on PCB

1.6 to 2.0

4.0 to 5.0

Rev.A

11/13

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