HSP061-4M10(2012) 데이터 시트보기 (PDF) - STMicroelectronics

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HSP061-4M10
(Rev.:2012)

4-line ESD protection for high speed lines

STMicroelectronics 

HSP061-4M10

Recommendation on PCB assembly

4.4

Reflow profile

Figure 14. ST ECOPACK® recommended soldering reflow profile for PCB mounting

Temperature (°C)

250

200

150

100

0.9 °C/s

50

0

30

60

90

240-245 °C

2 - 3 °C/s

60 sec

(90 max)

-2 °C/s

-3 °C/s

-6 °C/s

Time (s)

120 150 180 210 240 270 300

Note:

Minimize air convection currents in the reflow oven to avoid component movement.

Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020.

Doc ID 023716 Rev 2

9/11

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