HSP061-2N4 데이터 시트보기 (PDF) - STMicroelectronics

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HSP061-2N4

2-line ESD protection for high speed lines

STMicroelectronics 

HSP061-2

3

Package information

Package information

• Epoxy meets UL94, V0

• Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

b1

L1

L3

b

D

A

e

Table 3. SOT-666 dimensions

Dimensions

Ref.

Millimeters

Inches

Min. Typ. Max. Min. Typ. Max.

A 0.45

0.60 0.018

0.024

A3 0.08

0.18 0.003

0.007

b 0.17

0.34 0.007

0.013

E1

b1 0.19 0.27 0.34 0.007 0.011 0.013

D 1.50

1.70 0.059

0.067

E 1.50

L2

E

A3

E1 1.10

1.70 0.059

1.30 0.043

0.067

0.051

e

0.50

0.020

L1

0.19

0.007

L2 0.10

0.30 0.004

0.012

L3

0.10

0.004

Figure 11. Footprint recommendations

dimensions in mm (inches)

0.50

(0.019)

Figure 12. Marking for SOT-666

0.99

(0.039)

0.62 2.60

(0.024) (0.01)

0.30

(0.012)

R

DocID022777 Rev 2

5/12

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