HSP061-2P6(2012) 데이터 시트보기 (PDF) - STMicroelectronics

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HSP061-2P6
(Rev.:2012)

2-line ESD protection for high speed lines

STMicroelectronics 

Recommendation on PCB assembly

4

Recommendation on PCB assembly

HSP061-2

4.1

Stencil opening design

1. General recommendation on stencil opening design

a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).

Figure 17. Stencil opening dimensions

L

TW

b) General design rule

Stencil thickness (T) = 75 ~ 125 µm

Aspect

Ratio

=

W-----

T

≥ 1.5

Aspect Area

=

-------L-----×----W-----------

2T(L + W)

≥

0.66

2. Reference design

a) Stencil opening thickness: 100 µm

b) Stencil opening for leads: Opening to footprint ratio is 90%.

Figure 18. Recommended stencil window position for µQFN-6L

7 µm

7 µm

15 µm

236 µm

250 µm

15 µm

Footprint

Stencil window

Footprint

8/12

Doc ID 022777 Rev 1

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