HMC579(V01) 데이터 시트보기 (PDF) - Hittite Microwave
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HMC579 Datasheet PDF : 6 Pages
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v01.0608
Absolute Maximum Ratings
RF Input (Vdd = +5V)
Supply Voltage (Vdd1, Vdd2)
Channel Temperature
Continuous Pdiss (T= 85 °C)
(derate 7.3 mW/°C above 85 °C)
Thermal Resistance
(Channel to die bottom)
Storage Temperature
Operating Temperature
+13 dBm
+6.0 Vdc
175 °C
656 mW
137 °C/W
-65 to +150 °C
-55 to +85 °C
Outline Drawing
HMC579
GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 32 - 46 GHz OUTPUT
Typical Supply Current vs. Vdd
Vdd (V)
4.5
Idd (mA)
2
69
5.0
70
5.5
70
Note:
Multiplier will operate over full voltage range shown above.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Die Packaging Information [1]
Standard
Alternate [2]
GP-2 (Gel Pack)
—
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] Reference this suffix only when ordering alternate die
packaging.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS].
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004” SQUARE.
4. BOND PAD METALIZATION: GOLD
5. BACKSIDE METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND.
7. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS.
8. OVERALL DIE SIZE ± 0.002”
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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