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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

HMC571 데이터 시트보기 (PDF) - Hittite Microwave

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HMC571 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
Outline Drawing
3
v03.0808
HMC571
GaAs MMIC I/Q DOWNCONVERTER
21 - 25 GHz
3 - 142
Die Packaging Information [1]
Standard
Alternate
GP-1 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS 0.004”
3. BOND PAD METALIZATION: GOLD
4. BACKSIDE METALIZATION: GOLD
5. BACKSIDE METAL IS GROUND
6. OVERALL DIE SIZE ±0.002
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com

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