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HMC346

GaAs MMIC VOLTAGE-VARIABLE ATTENUATOR, DC - 20 GHz

Hittite Microwave 

Outline Drawing

v04.1008

1. ALL DIMENSIONS ARE IN INCHES (MILLIMETERS).

2. TYPICAL BOND PAD IS .004” SQUARE.

3. TYPICAL BOND PAD SPACING IS .006” CENTER TO

CENTER EXCEPT AS NOTED.

4. BACKSIDE METALIZATION: GOLD

5. BACKSIDE METAL IS GROUND

6. BOND PAD METALIZATION: GOLD

HMC346

GaAs MMIC VOLTAGE-VARIABLE

ATTENUATOR, DC - 20 GHz

1

Die Packaging Information [1]

Standard

Alternate

GP-2 (Gel Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

Pad Descriptions

Pad Number

Function

1, 2

RF1 Input,

RF2 Output

Description

This pad is DC coupled and matched to 50 Ohm.

Blocking capacitors are required if RF line potential

is not equal to 0V.

3, 6

V2, V1

Control Input (Master).

Interface Schematic

4

I

Control Input (Slave).

5

500

This pad must be DC grounded.

GND

Die bottom must be connected to RF ground.

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

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