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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

HMC-ABH264 데이터 시트보기 (PDF) - Hittite Microwave

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HMC-ABH264 Datasheet PDF : 6 Pages
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v01.0209
Absolute Maximum Ratings
Drain Bias Voltage (Vdd1, Vdd2, Vdd3)
Gate Bias Voltage (Vgg)
RF Input Power (RFIN)(Vdd = +5Vdc)
Channel Temperature
Continuous Pdiss (T= 85 °C)
(derate 10.8 mW/°C above 85 °C)
Thermal Resistance
(channel to die bottom)
Storage Temperature
Operating Temperature
5.5 V
-1 to 0.3 Vdc
+10 dBm
180 °C
1W
93 °C/W
-65 to +150 °C
-55 to +85 °C
Outline Drawing
HMC-ABH264
GaAs PHEMT MMIC MEDIUM
POWER AMPLIFIER, 34 - 42 GHz
Typical Supply Current vs. Vdd
Vdd (V)
Idd (mA)
4.0
114
4.5
117
5.0
120
Note: Amplifier will operate over full voltage ranges shown above.
Vgg adjusted to achieve Idd= 120mA at +5V.
3
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Die Packaging Information [1]
Standard
Alternate
GP-2 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND IS .004” SQUARE
4. BACKSIDE METALLIZATION: GOLD
5. BOND PAD METALLIZATION: GOLD
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
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