HLMP-AD61 데이터 시트보기 (PDF) - Avago Technologies

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HLMP-AD61

Precision Optical Performance Red, Green and Blue 5mm Mini Oval LEDs

Avago Technologies 

Precautions

Lead Forming:

• The leads of an LED lamp may be preformed or cut

to length prior to insertion and soldering into PC

board.

• If lead forming is required before soldering, care must

be taken to avoid any excessive mechanical stress

induced to LED package. Otherwise, cut the leads of

LED to length after soldering process at room

temperature. The solder joint formed will absorb the

mechanical stress of the lead cutting from traveling

to the LED chip die attach and wirebond.

• For better control, it is recommended to use proper

tool to precisely form and cut the leads to length

rather that doing it manually.

Soldering Condition:

• Care must be taken during PCB assembly and solder-

ing process to prevent damage to LED component.

• The closest manual soldering distance of the

soldering heat source (soldering iron’s tip) to the

body is 1.59mm. Soldering the LED closer than

1.59mm might damage the LED.

1.59mm

• Recommended soldering condition:

Pre-heat temperature

Preheat time

Peak temperature

Dwell time

Wave

Soldering

105 °C Max.

30 sec Max

250 °C Max.

3 sec Max.

Manual Solder

Dipping

-

-

260 °C Max.

5 sec Max

• Wave soldering parameter must be set and maintain

according to recommended temperature and dwell

time in the solder wave. Customer is advised to daily

check on the soldering profile to ensure the soldering

profile used is always conforming to recommended

soldering condition.

Note:

1. PCB with different size and design (component density) will

have different heat mass (heat capacity). This might cause a

change in temperature experienced by the board if same wave

soldering setting is used. So, it is recommended to re-calibrate

the soldering profile again prior to loading a new type of PCB.

2. Avago Technologies’ high brightness LED are using high

efficiency LED die with single wire bond as shown below.

Customer is advised to take extra precaution during wave

soldering to ensure that the maximum wave temperature is

not exceeding recommendation of 250 ° C. Over-stressing the

LED during soldering process might cause premature failure

to the LED due to delamination.

9

Avago Technologies LED configuration

AlInGaP Device

InGaN Device

Note: Electrical connection between bottom surface of LED die

and the leadframe material through conductive paste or solder.

• If necessary, use fixture to hold the LED component

in proper orientation with respect to the PCB during

soldering process.

Note: In order to further assist customer in designing jig

accurately that fit Avago Technologies’ product, 3D model of the

product is available upon request.

• At elevated temperature, the LED is more

susceptible to mechanical stress. Therefore, PCB

must be allowed to cool down to room temperature

prior to handling, which includes removal of jigs,

fixtures or pallet.

• Special attention must be given to board fabrication,

solder masking, surface plating and lead holes size

and component orientation to assure solderability.

• Recommended PC board plated through holes size

for LED component leads.

LED component Diagonal

Lead size

0.457 x 0.457mm 0.646 mm

(0.018 x 0.018inch) (0.025 inch)

0.508 x 0.508mm 0.718 mm

(0.020 x 0.020inch) (0.028 inch)

Plated through

hole diameter

0.976 to 1.078 mm

(0.038 to 0.042 inch)

1.049 to 1.150mm

(0.041 to 0.045 inch)

Note: Refer to application note AN1027 for more information

on soldering LED components.

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