HCTS373D/SAMPLE 데이터 시트보기 (PDF) - Intersil
부품명
상세내역
일치하는 목록
HCTS373D/SAMPLE Datasheet PDF : 11 Pages
| |||
HCTS373MS
Die Characteristics
DIE DIMENSIONS:
108 x 106 mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
D0
Q0
(3)
(2)
HCTS373MS
OE
VCC
Q7
(1)
(20)
(19)
D1 (4)
Q1 (5)
Q2 (6)
(18) D7
(17) D6
(16) Q6
(15) Q5
D2 (7)
(14) D5
(8)
(9)
D3
Q3
(10)
(11)
GND
LE
(12)
(13)
Q4
D4
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS373 is TA14403A.
Spec Number 518636
647
Share Link: 