H11AA2.300W 데이터 시트보기 (PDF) - Fairchild Semiconductor
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H11AA2.300W Datasheet PDF : 8 Pages
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Marking Information
1
H11AA1 2
V XX YY K 6
3
4
5
Definitions
1 Fairchild logo
2 Device number
3 VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
4 Two digit year code, e.g., ‘03’
5 Two digit work week ranging from ‘01’ to ‘53’
6 Assembly package code
Reflow Profile (Black Package, No Suffix)
300
215°C, 10–30 s
250
225 C peak
200
150
100
Time above 183°C, 60–150 sec
50
Ramp up = 3C/sec
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5
Time (Minute)
• Peak reflow temperature: 225°C (package surface temperature)
• Time of temperature higher than 183°C for 60–150 seconds
• One time soldering reflow is recommended
7
H11AA1, H11AA3, H11AA2, H11AA4 Rev. 1.0.0
www.fairchildsemi.com
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