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GS9077

HD-LINX® III SD-SDI Cable Driver

Gennum -> Semtech 

Contents

GS9077 Data Sheet

Features ........................................................................................................................1

Applications ...................................................................................................................1

Description ....................................................................................................................1

1. Pin Out ......................................................................................................................3

1.1 Pin Assignment ...............................................................................................3

1.2 Pin Descriptions ..............................................................................................3

2. Electrical Characteristics ...........................................................................................4

2.1 Absolute Maximum Ratings ............................................................................4

2.2 DC Electrical Characteristics ..........................................................................4

2.3 AC Electrical Characteristics ...........................................................................5

2.4 Solder Reflow Profiles .....................................................................................6

3. Input / Output Circuits ...............................................................................................7

4. Detailed Description ..................................................................................................8

4.1 Input Interfacing ..............................................................................................8

4.2 Output Interfacing ...........................................................................................8

4.2.1 Output Amplitude (RSET) ......................................................................9

4.2.2 Output Disable .......................................................................................9

4.3 Output Return Loss Measurement ..................................................................9

5. Application Information............................................................................................10

5.1 PCB Layout ...................................................................................................10

5.2 Typical Application Circuit .............................................................................10

6. Package & Ordering Information .............................................................................11

6.1 Package Dimensions ....................................................................................11

6.2 Recommended PCB Footprint ......................................................................12

6.3 Packaging Data .............................................................................................12

6.4 Marking Diagram ...........................................................................................13

6.5 Ordering Information .....................................................................................13

7. Revision History ......................................................................................................14

44619 - 0 May 2007

2 of 14

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