6. Package and Ordering Information
6.1 Package Dimensions
D
X
E
Pin 1
ID Mark
e
B
A
A1
q2
DETAIL “A”
0.010
Gauge Plane
Seating Plane
L
0.015 ±0.004 x 45°
q1
DETAIL “A”
C
NOTES:
1. All dimensions in inches unless otherwise stated.
2. Lead coplanarity should be 0 to 0.004” max.
3. Package surface finishing: VDI 24~27 (dual).
Package surface finishing: VDI 13~15 (16L SOIC[NB] matrix).
4. All dimensions exclude mold flashes.
5. The lead width (B) to be determined at 0.0075”
from the lead tip.
Figure 6-1: Package Dimensions
8 SOIC
Min.
Max.
A
0.054
0.068
A1
0.004
0.0098
B
0.014
0.019
D
0.189
0.196
E
0.150
0.157
H
0.229
0.244
e
0.050 BSC
C
0.0075
0.0098
L
0.016
0.034
X
0.0215 REF
q1
0°
8°
q2
7° BSC
6.2 Ordering Information
Part Number
GS9068-CKAE3
GS9068-CTAE3
Package
8 pin SOIC
8 pin SOIC Tape
Temperature Range
0°C to 70°C
0°C to 70°C
7. Revision History
Pb-free and Green
Yes
Yes
Version
A
B
0
1
2
3
4
ECR
120608
125775
127024
128544
133977
139114
154753
PCN
–
–
–
–
–
38124
–
Date
July 2002
July 2002
December 2002
March 2003
June 2004
January 2006
August 2010
Changes And/or Modifications
New document.
Added detailed block descriptions and initial applications
information.
Document upgraded to Preliminary Data Sheet and AC/DC
Characteristics edited to match current design specification limits.
Document upgraded to Data Sheet.
Added lead-free and green information.
Corrected Input Differential Swing to 2200mV.
Corrected Package Dimensions and Ordering Information.
GS9068 SD SDI Cable Driver
Data Sheet
22213 - 4
August 2010
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