2. ELECTRICAL CHARACTERISTICS
2.1 ABSOLUTE MAXIMUM RATINGS
PARAMETER
Supply Voltage
Input ESD Voltage
Storage Temperature Range
Input Voltage Range (any input)
Operating Temperature Range
Power Dissipation
Lead Temperature (soldering, 10 sec.)
VALUE
-0.5V to +3.6 VDC
500V
-50°C< Ts < 125°C
-0.3 to (VCC + 0.3)V
0°C to 70°C
300mW
260°C
2.2 DC ELECTRICAL CHARACTERISTICS
VCC = 3.3V , VEE = 0V , TA = 0°C to 70°C, 270Mb/s, unless otherwise shown
PARAMETER
SYMBOL
CONDITIONS
TEST
MIN
TYPICAL
MAX UNITS LEVEL NOTES
Supply Voltage
VCC
3.1
3.3
3.5
V
1
-
Power Consumption
PD
TA = 25°C
-
265
-
mW
5
-
Supply Current
ΙS
TA = 25°C
-
80
-
mA
1
-
Input Common Mode Voltage
VCMIN
-
1.75
-
V
10
-
Output Common Mode Voltage
VCMOUT
-
VCC - ∆VSDO/2
-
mV
7
-
CLI DC Voltage
Cable length = 0m
-
2.5
-
V
1
-
No signal (max
-
1.9
-
V
7
-
cable length)
Floating MCLADJ DC Voltage
-
1.3
-
V
7
-
MCLADJ Range
0m to max cable
-
0.69
-
V
7
-
length
CD/Mute Output Voltage
VCD/Mute(OH) Carrier not present
2.6
-
-
V
1
-
VCD/Mute(OL) Carrier present
-
-
1.2
1
-
CD/Mute Input Voltage
Required to Force Outputs to
Mute
VCD/Mute)
Min to Mute
3.0
-
-
V
7
-
CD/Mute Input Voltage
VCD/Mute
Max to Activate
-
Required to Force Outputs to
Activate
-
2.0
V
7
-
TEST LEVELS
1. Production test at room temperature and nominal supply voltage with guardbands for supply and temperature ranges.
2. Production test at room temperature and nominal supply voltage with guardbands for supply and temperature ranges using
correlated test.
3. Production test at room temperature and nominal supply voltage.
4. QA sample test.
5. Calculated result based on Level 1, 2, or 3.
6. Not tested. Guaranteed by design simulations.
7. Not tested. Based on characterization of nominal parts.
8. Not tested. Based on existing design/characterization data of similar product.
9. Indirect test.
10. Wafer Probe
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