FX-424 데이터 시트보기 (PDF) - Vectron International

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FX-424

Low Jitter Frequency Translator

Vectron International 

FX-424 Low Jitter Frequency Translator

eliability

Handling Precautions

Although ESD protection circuitry has been designed into the FX-424 proper precautions should be taken when

handling and mounting. VI employs a human body model (HBM) and a charged-device model (CDM) for ESD

susceptibility testing and design protection evaluation

ESD Ratings

Model

Human Body Model

Charged Device Model

Minimum

500 V

500 V

Conditions

MIL-STD 883, Method 3015

JEDEC, JESD22-C101

Reflow Profile (IPC/JEDEC J-STD-020C)

Parameter

Symbol

PreHeat Time

Ramp Up

Time Above 217 oC

Time To Peak Temperature

Time At 260 oC

Ramp Down

tS

R UP

tL

t AMB-P

tP

R DN

The FX-424 is being qualified to meet the JEDEC

standard for Pb-Free assembly. The temperatures

and time intervals listed are based on the Pb-Free

small body requirements. The temperatures refer to

the topside of the package, measured on the package

body surface. The FX-424 should not be subjected to

a wash process that will immerse it in solvents. NO

.CLEAN is the recommended procedure. The FX-424

has been designed for pick and place reflow

soldering. The FX-424 may be reflowed once and

should not be reflowed in the inverted position.

Value

60 sec Min, 180 sec Max

3 oC/sec Max

60 sec Min, 150 sec Max

480 sec Max

20 sec Min, 40 sec Max

6 oC/sec Max

260

R

217

200

150

tS

t AMB-P

tL

tP

R DN

25

Time (sec)

Vectron International, 267 Lowell Road, Hudson, NH 03051

Page 5 of 8

Tel: 1-88-VECTRON-1 • Web: www.vectron.com

Rev: 12Dec05

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