FAN2558MP13X 데이터 시트보기 (PDF) - Fairchild Semiconductor

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FAN2558MP13X

180mA Low Voltage CMOS LDO

Fairchild Semiconductor 

PRODUCT SPECIFICATIONS

Absolute Maximum Ratings

Parameter

VIN to GND

Voltage on any other pin to GND

Junction Temperature (TJ)

Storage Temperature

Lead Soldering Temperature, 10 seconds

Power Dissipation (PD)

Electrostatic Discharge (ESD) Protection (Note1)

FAN2558/FAN2559

HBM

CDM

Min.

-0.3

-55

-65

4

1

Max.

6

VIN + 0.3

150

150

300

Internally

Limited

Units

V

V

°C

°C

°C

W

kV

Recommended Operating Conditions

Parameter

Min.

Supply Voltage Range, VIN for VOUT < 2.0V

Supply Voltage Range, VIN for VOUT ≥ 2.0V

Load Current

2.7

VOUT + VDROPOUT

Enable Input Voltage VEN

0

Power Good Output Voltage Range VPG

0

Junction Temperature

-40

Thermal Resistance-Junction to Ambient SOT-23 (Note 2)

Thermal Resistance-Junction to Case, 2mm x 2mm

6-lead MLP

Typ.

Max.

5.5

5.5

180

VIN

VIN

125

235

75

Units

V

V

mA

V

V

°C

°C/W

Notes:

1. Using Mil Std. 883E, method 3015.7 (Human Body Model) and EIA/JESD22C101-A (Charge Device Model)

2. Junction to ambient thermal resistance, ΘJC, is a strong function of PCB material, board thickness, thickness and number of

copper plains, number of via used, diameter of via used, available copper surface, and attached heat sink characteristics.

REV. 1.0.4 3/15/04

3

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