ESDA5V3LY(2012) 데이터 시트보기 (PDF) - STMicroelectronics
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ESDA5V3LY Datasheet PDF : 10 Pages
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ESDALY
Figure 13. Tape and reel specifications
2.0
0.21
Recommendation on PCB assembly
Ø 1.55
4.0
1.24
All dimensions are typical values in mm
3.1
4.0
User direction of unreeling
5
Recommendation on PCB assembly
5.1
Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed.
4. Solder paste with fine particles: powder particle size is 20-45 µm.
5.2
Placement
1. Manual positioning is not recommended.
2. It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering.
3. Standard tolerance of ± 0.05 mm is recommended.
4. 3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
5. To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
Doc ID 022075 Rev 1
7/10
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