datasheetbank_Logo
전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

EMC1204(2006) 데이터 시트보기 (PDF) - SMSC -> Microchip

부품명
상세내역
일치하는 목록
EMC1204 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
Triple/Quad Single-Wire Temp Sensor in MSOP-8 Using SMSC BudgetBusTM Sensor Interface
Chapter 4 Package Outline
Datasheet
Figure 4.1 8-Pin MSOP Package Outline - 3x3mm Body 0.65mm Pitch
Table 4.1 8-Pin MSOP Package Parameters
MIN
NOMINAL
MAX
REMARKS
A
0.80
~
1.10
A1
0.05
~
0.15
A2
0.75
0.85
0.95
D
2.80
3.00
3.20
E
4.65
4.90
5.15
E1
2.80
~
3.20
H
0.08
~
0.23
L
0.40
~
0.80
L1
0.95 REF
e
0.65 BSC
θ
0o
~
8o
W
0.22
~
0.38
ccc
~
~
0.10
Overall Package Height
Standoff
Body Thickness
X Body Size
Y Span
Y body Size
Lead Foot Thickness
Lead Foot Length
Lead Length
Lead Pitch
Lead Foot Angle
Lead Width
Coplanarity
Notes:
1. Controlling Unit: millimeters.
2. Tolerance on the true position of the leads is ± 0.065 mm maximum.
3. Package body dimensions D and E1 do not include mold protrusion or flash. Dimensions D and
E1 to be determined at datum plane H. Maximum mold protrusion or flash is 0.15mm (0.006 inches)
per end, and 0.15mm (0.006 inches) per side.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
Revision 1.1 (06-12-06)
8
DATASHEET
SMSC EMC1203/EMC1204

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]