EM4169B6WT7E 데이터 시트보기 (PDF) - EM Microelectronic - MARIN SA
부품명
상세내역
일치하는 목록
EM4169B6WT7E
EM Microelectronic - MARIN SA
EM4169B6WT7E Datasheet PDF : 15 Pages
| |||
EM4069
EM4169
Packages
FRONT VIEW
CID Package
J
K
TOP VIEW
B
D
MARKING
AREA
R
SYMBOL MIN TYP
A
8.2
8.5
B
3.8
4.0
D
5.8
6.0
e
0.38 0.5
F
1.25 1.3
g
0.3
0.4
J
0.42 0.44
A
K
0.115 0.127
R
0.4
0.5
Dimensions are in mm
MAX
8.8
4.2
6.2
0.62
1.35
0.5
0.46
0.139
0.6
e
C2 C1
F
F
g
Fig. 17
PCB Package
Y
Z
X
C2 C1
SYMBOL MIN TYP
X
8.0
Y
4.0
Z
Dimensions are in mm
MAX
1.0
Fig. 18
Ordering Information
Die Form
This chart shows general offering; for detailed Part Number to order, please see the table “Standard Versions” below.
EM4069 A6 WS 11 - %%%
Circuit Nb:
EM4069: standard pads
EM4169: mega pads
Customer Version:
%%% = only for custom specific version
Version:
A6 = Manchester, 64 clocks per bit
A5 = Manchester, 32 clocks per bit
B6 = Bi-phase, 64 clocks per bit
B5 = Bi-phase, 32 clocks per bit
Bumping:
" " (blank) = no bumps (EM4069 only)
E = with Gold Bumps (for EM4169 only)
Die form:
WW = Wafer
WS = Sawn Wafer/Frame
WT = Sticky Tape
WP = Waffle Pack (note 1)
Thickness:
7 = 7 mils (178um)
11 = 11 mils (280um)
Copyright 2003, EM Microelectronic-Marin SA
14
www.emmicroelectronic.com
Share Link: