EM4022V21WS11 데이터 시트보기 (PDF) - EM Microelectronic - MARIN SA

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EM4022V21WS11

Multi Frequency Contactless Identification Device Anti-Collision compatible with BTG's Supertag Category Protocols

EM Microelectronic - MARIN SA 

Typical Operating Configurations

Low frequency inductive transponder .

M

VDD

Coil1

CPX

L

EM4022

Coil2

GAP VSS

D1

Fig. 2

Low frequency applications are those applications that

can make use of the on-chip full wave rectifier bridge to

rectify the incident energy. These are typically

applications that use inductive coupling to transmit

energy to the chip. The carrier frequency is typically less

than 500 kHz. The design of the on-chip rectifier and

resonance capacitor is optimized for frequencies in the

order of 125 kHz. Low frequency transponders can be

implemented using just a EM4022 chip and an external

coil that resonates with the on-chip tuning capacitor at

the required carrier frequency. An external power

storage capacitor is required to maintain the supply

voltage above the integrated power on reset level.

In a very strong field, due to the forward resistance of the

diode, the GAP input must be limited at VSS-0.3V by a

schottky diode (D1)

Medium frequency (13.56 MHz) inductive transponder

implementation

M

VDD

EM4022

C

L

D2*

GAP VSS

CPX

D1

Fig. 3

L:

coil antenna (typical value 1.35 µH).

C:

tuning capacitor (typical value 100 pF)

EM4022

Medium frequency applications are those which cannot

use the integrated full wave rectifier and where the

transponder power is transmitted through a coil. External

microwave schottky diodes are required to rectify the

carrier wave. An external power storage capacitor can be

added to improve reading range.

These applications allow higher data rates (64 kbit/s).

Where reading rates of 500 transponders per second

can be achieved

High frequency RF transponder implementation.

D3

D2*

M

VDD

Coil1

EM4022

Coil2

GAP VSS

CPX

D1

Fig. 4

D2 in figure 2 and 3 is optional and is only used for GAP

enable versions. All diodes are schottky type.

High frequency applications are similar to medium

frequency applications. These are typically applications

that use electromagnetic RF coupling to transmit energy

to the chip using carrier frequencies greater than

100 MHz. High frequency transponders can be

implemented using a EM4022 chip, two or three

microwave diodes and a printed antenna. High frequency

RF coupled applications typically have higher reading

distances (> 4 m) and

Bi-frequency applications are possible by implementing

a coil between coil1 and coil2 connections in the high

frequency application (fig. 4).

Copyright  2002, EM Microelectronic-Marin SA

2

www.emmicroelectronic.com

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