CXB1810FN 데이터 시트보기 (PDF) - Sony Semiconductor

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CXB1810FN

Post Amplifier for Optical Fiber Communication Receiver

Sony Semiconductor 

CXB1810FN

3. Substrate layout

The exposed metal portions on the rear surface of the package used for the CXB1810FN are electrically

connected to the silicon substrate. Superior thermal radiation characteristics can be obtained by connecting

the rear surface of the package and these exposed metal portions to the ground surface on the PCB.

Providing lands directly below the package as shown in the figure below and connecting as many thermal vias

as possible to the inner layer ground surface is recommended.

0.4mm

0.25mm

1.45mm 0.75mm 2.0mm

4. Other

• Be careful when handling this IC as its electrostatic discharge strength is weak.

• Be sure to connect all power supply pins (VCCO, VCC) and ground pins (VEEO, VEE) to power supplies or

grounds, respectively. For example, if only VCCO is left open and power is supplied to the other pin, the IC

may malfunction.

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