CXA1691BM 데이터 시트보기 (PDF) - Sony Semiconductor

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CXA1691BM

FM/AM Radio

Sony Semiconductor 

Package Outline Unit : mm

CXA1691BM

28

28PIN SOP (PLASTIC)

+ 0.4

18.8 – 0.1

15

+ 0.4

2.3 – 0.15

0.15

+ 0.2

0.1 – 0.05

1

0.45 ± 0.1

14

1.27

+ 0.1

0.2 – 0.05

CXA1691BM/BS

CXA1691BS

0.24 M

SONY CODE

EIAJ CODE

JEDEC CODE

SOP-28P-L04

SOP028-P-0375

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER PLATING

42/COPPER ALLOY

0.7g

30PIN SDIP (PLASTIC)

+ 0.4

26.9 – 0.1

30

16

1

15

1.778

0° to 15°

0.5 ± 0.1

0.9 ± 0.15

SONY CODE

EIAJ CODE

JEDEC CODE

SDIP-30P-01

SDIP030-P-0400

Two kinds of package surface:

1.All mat surface type.

2.All mirror surface type.

PACKAGE STRUCTURE

MOLDING COMPOUND EPOXY RESIN

LEAD TREATMENT

SOLDER/PALLADIUM

PLATING

LEAD MATERIAL

COPPER ALLOY

PACKAGE MASS

1.8g

NOTE : PALLADIUM PLATING

This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).

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