CS8361YDPS7 데이터 시트보기 (PDF) - Cherry semiconductor
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CS8361YDPS7 Datasheet PDF : 6 Pages
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Application Notes: continued
Heat Sinks
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment will have a thermal resistance. Like
series electrical resistances, these resistances are summed
to determine the value of RQJA:
RQJA = RQJC + RQCS + RQSA
(3)
where:
RQJC = the junctionÐtoÐcase thermal resistance,
RQCS = the caseÐtoÐheat sink thermal resistance, and
RQSA = the heat sinkÐtoÐambient thermal resistance.
RQJC appears in the package section of the data sheet. Like
RQJA, it too is a function of package type. RQCS and RQSA
are functions of the package type, heat sink and the inter-
face between them. These values appear in heat sink data
sheets of heat sink manufacturers.
Test & Application Circuits
B+
VIN
VSTBY
0.1µF C1*
CS8361
R3
RESET
5V, 100mA
C2**
10µF
ESR<8Ω
VDD
MCU
RESET
ENABLE
I/O
R2
Adj
R1
Gnd
VTRK
C3**
SW 8V,
250mA
10µF
Gnd
ESR<8Ω
VTRK ~ VSTBY (1 + R1/R2)
For VTRK ~ 8V, R1/R2 ~ 0.6
* C1 is required if regulator is located far from power supply filter.
** C2 and C3 are required for stability.
Figure 2: 5V, 8V Regulator
B+
0.1µF
VIN
VSTBY
C1*
CS8361
RESET
ENABLE
Adj
Gnd
VTRK
5V, 100mA
VDD
R1
C2**
10µF
ESR<8Ω
MCU
RESET
I/O
SW 5V,
250mA
Gnd
C3**
10µF
ESR<8Ω
* C1 is required if regulator is located far from power supply filter.
** C2 and C3 are required for stability.
Figure 3: Dual 5V Regulator
5
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