CS8120YT5 데이터 시트보기 (PDF) - ON Semiconductor
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CS8120YT5 Datasheet PDF : 14 Pages
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CS8120
PACKAGE DIMENSIONS
SO−14
D SUFFIX
CASE 751A−03
ISSUE F
−A−
14
8
−B− P 7 PL
1
7
0.25 (0.010) M B M
G
C
R X 45 _
F
−T−
SEATING
D 14 PL
K
M
J
PLANE
0.25 (0.010) M T B S A S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 8.55 8.75 0.337 0.344
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G
1.27 BSC
0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0_ 7_ 0_ 7_
P 5.80 6.20 0.228 0.244
R 0.25 0.50 0.010 0.019
NOTE 2
8
5
1
4
F
−A−
−B−
DIP−8
N SUFFIX
CASE 626−05
ISSUE L
L
C
−T−
J
SEATING
N
PLANE
D
K
M
H
G
0.13 (0.005) M T A M B M
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 9.40 10.16 0.370 0.400
B 6.10 6.60 0.240 0.260
C 3.94 4.45 0.155 0.175
D 0.38 0.51 0.015 0.020
F 1.02 1.78 0.040 0.070
G
2.54 BSC
0.100 BSC
H 0.76 1.27 0.030 0.050
J 0.20 0.30 0.008 0.012
K 2.92 3.43 0.115 0.135
L
7.62 BSC
0.300 BSC
M −−− 10_ −−− 10_
N 0.76 1.01 0.030 0.040
PACKAGE THERMAL DATA
Parameter
TO−220−5
D2PAK−5
DIP−8
RqJC Typical
3.1
3.1
52
RqJA
Typical
50
10−50*
100
* Depending on thermal properties of substrate. RqJA = RqJC + RqCA
SO−14
30
125
Unit
°C/W
°C/W
http://onsemi.com
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