CMM-5-BD 데이터 시트보기 (PDF) - Mimix Broadband
부품명
상세내역
일치하는 목록
CMM-5-BD Datasheet PDF : 5 Pages
| |||
2.0-6.0 GHz
GaAs MMIC Amplifier
January 2007 - Rev 15-Jan-07
Specifications (TA = 25ºC,VDD = 6V, 2-6 GHz)
CMM-5-BD
Die Attach and Bonding Procedures
Die Attach: Conductive epoxy or preform die attach is recom-
mended. For preform die attach: Preform: AuSn (80% Au, 20%
Sn); Stage Temperature: 290 ºC, +/-5 ºC; Handling Tool: Tweezers;
Time: 1 min or less.
Bonding Diagram
Wire Bonding: Wire Size: 0.7 to 1.0 mil in diameter (pre-
stressed); Thermocompression bonding is preferred over
thermosonic bonding. For thermocompression bonding: Stage
Temperature: 250 ºC ; Bond Tip Temperature: 150 ºC; Bonding
Tip Pressure: 18 to 40 gms depending on size of wire.
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 2 of 5
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
Share Link: 