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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

24C16 데이터 시트보기 (PDF) - ON Semiconductor

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24C16 Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
PACKAGE DIMENSIONS
WLCSP5, 0.84x0.86
CASE 567DD
ISSUE B
ÈÈÈÈD
PIN A1
REFERENCE
AB
E
2X
0.10 C
2X
0.10 C TOP VIEW
0.10 C
A2
A
0.05 C
NOTE 4
A1
SIDE VIEW
C
SEATING
PLANE
NOTE 3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C, THE SEATING PLANE, IS DEFINED BY THE
SPHERICAL CROWNS OF THE CONTACT BALLS.
4. COPLANARITY APPLIES TO SPHERICAL CROWNS
OF THE CONTACT BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM CON-
TACT BALL DIAMETER PARALLEL TO DATUM C.
MILLIMETERS
DIM MIN MAX
A 0.29 0.39
A1 0.10 0.14
A2
0.23 REF
b 0.14 0.18
D
0.84 BSC
E
0.86 BSC
e
0.30 BSC
e1
0.52 BSC
5X b
0.10 M C A B
C
NOTE 5
B
A
e
e1
PIN A1
123
REFERENCE
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
A1
PACKAGE
OUTLINE
0.52
PITCH
5X
0.16
0.30
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
17

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