PI3B3244LE(2010) 데이터 시트보기 (PDF) - Pericom Semiconductor
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PI3B3244LE Datasheet PDF : 4 Pages
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Packaging Mechanical: 20-Pin TSSOP (L)
20
.169 4.3
.177 4.5
1
.252
.260
6.4
6.6
.047
1.20
Max
SEATING
PLANE
.0256
BSC
0.65
.007
.012
0.19
0.30
.002 0.05
.006 0.15
Note:
1. Package Outline Exclusive of Mold Flash and Metal Burr
2. Controlling dimentions in millimeters
3. Ref: JEDEC MO-153F/AC
PI3B3244
3.3V, Hot Insertion, 8-Bit, 2-Port NanoSwitchTM
DOCUMENT CONTROL NO.
PD - 1311
REVISION: E
DATE: 03/09/05
0.45 .018
0.75 .030
.238
.269
6.1
6.7
.004 0.09
.008 0.20
Pericom Semiconductor Corporation
3545 N. 1st Street, San Jose, CA 95134
1-800-435-2336 • www.pericom.com
DESCRIPTION: 20-Pin, 173-Mil Wide, TSSOP
PACKAGE CODE: L
Ordering Information
Ordering Code
PI3B3244LE
Package Code
L
Package Type
Pb-free & Green, 20-pin TSSOP
1. Thermal characteristics can be found on the company web site at www.pericom.com/packaging/
Pericom Semiconductor Corporation • 1-800-435-2336
All trademarks are property of their respective owners.
11-0003
4
www.pericom.com
PS8149H
09/27/10
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