BD5461GUL 데이터 시트보기 (PDF) - ROHM Semiconductor
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BD5461GUL Datasheet PDF : 17 Pages
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BD5461GUL
Technical Note
●About the thermal design by the IC
Characteristics of an IC have a great deal to do with the temperature at which it is used, and exceeding absolute maximum
ratings may degrade and destroy elements. Careful consideration must be given to the heat of the IC from the two
standpoints of immediate damage and long-term reliability of operation. Pay attention to points such as the following.
Since an maximum junction temperature (TjMAX.)or operating temperature range (Topr) is shown in the absolute maximum
ratings of the IC, to reference the value, find it using the Pd-Ta characteristic (temperature derating curve).
If an input signal is too great when there is insufficient radiation, TSD (thermal shutdown) may operate.
TSD, which operates at a chip temperature of approximately +180℃, is canceled when this goes below approximately +100℃.
Since TSD operates persistently with the purpose of preventing chip damage, be aware that long-term use in the vicinity
that TSD affects decrease IC reliability.
Temperature Derating Curve
Reference data
VCSP50L1
1.5
measurement conditions ： IC unit and Rohm standard board mount
board size ： 50mm×58mm
1.0
0.69W
0.5
θja = 181.8℃/W
0.0
0
25
50
75 85 100
125
150
Ambient Temperature Ta(℃)
Note) Values are actual measurements and are not guaranteed.
Power dissipation values vary according to the board on which the IC is mounted. The Power dissipation of this IC when
mounted on a multilayer board designed to radiate is greater than the values in the graph above.
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9/16
2010.06 - Rev.A
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