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BAT54DW

DUAL SURFACE MOUNT SCHOTTKY BARRIER DIODE

Diodes Incorporated. 

Features

• Low Forward Voltage Drop

• Fast Switching

• Ultra-Small Surface Mount Package

• PN Junction Guard Ring for Transient and ESD Protection

• Lead Free/RoHS Compliant (Note 3)

• "Green" Device (Note 4 and 5)

BAT54DW

DUAL SURFACE MOUNT SCHOTTKY BARRIER DIODE

Mechanical Data

• Case: SOT-363

• Case Material: Molded Plastic. UL Flammability Classification

Rating 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020D

• Terminals: Solderable per MIL-STD-202, Method 208

• Lead Free Plating (Matte Tin Finish annealed over Alloy 42

leadframe).

• Terminal Connections: See Diagram

• Marking Information: See Page 2

• Ordering Information: See Page 2

• Weight: 0.006 grams (approximate)

C1

NC

A2

Top View

A1

NC

C2

Device Schematic

Maximum Ratings @TA = 25°C unless otherwise specified

Characteristic

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

Average Rectified Forward Current

Forward Continuous Current (Note 1)

Repetitive Peak Forward Current (Note 1)

Forward Surge Current (Note 1)

@ t < 1.0s

Symbol

VRRM

VRWM

VR

IO

IF

IFRM

IFSM

Value

30

100

200

300

600

Unit

V

mA

mA

mA

mA

Thermal Characteristics

Characteristic

Power Dissipation (Note 1)

Thermal Resistance, Junction to Ambient Air (Note 1)

Operating and Storage Temperature Range

Symbol

PD

RθJA

TJ, TSTG

Value

200

625

-65 to +125

Unit

mW

°C/W

°C

Electrical Characteristics @TA = 25°C unless otherwise specified

Characteristic

Reverse Breakdown Voltage (Note 2)

Forward Voltage

Reverse Leakage Current (Note 2)

Total Capacitance

Reverse Recovery Time

Symbol Min

V(BR)R

30

VF

⎯

IR

⎯

CT

⎯

trr

⎯

Typ Max Unit

Test Condition

⎯

⎯

V IRS = 100μA

240

IF = 0.1mA

320

IF = 1mA

⎯

400

mV IF = 10mA

500

1000

IF = 30mA

IF = 100mA

⎯

2.0

μA VR = 25V

⎯

10

pF VR = 1.0V, f = 1.0MHz

⎯

5.0

ns

IF = 10mA through IR = 10mA

to IR = 1.0mA, RL = 100Ω

Notes:

1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which

can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.

2. Short duration pulse test used to minimize self-heating effect.

3. No purposefully added lead.

4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.

BAT54DW

Document number: DS30107 Rev. 11 - 2

1 of 3

www.diodes.com

July 2008

© Diodes Incorporated

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