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H1563P

HIGH-EFFICIENCY DC/DC CONVERTER

Hi-Sincerity Microelectronics 

HI-SINCERITY

MICROELECTRONICS CORP.

H1563P Dimension (DIP-8P)

Spec. No. : HP200201

HS200207

Issued Date : 2000.10.01

Revised Date : 2002.07.12

Page No. : 7/8

87 6 5

A

12 3 4

B

J

F

Marking:

H

15 63

P

Date Code

DIP-8P Plastic Package

HSMC Package Code: P

C

EG

DH

I

α1 K

M

L

DIM

Inches

Min.

Max.

A 0.2480 0.2520

B 0.3630 0.3670

C

-

*0.0600

D

-

*0.0500

E

-

*0.0390

F 0.1280 0.1320

G 0.1250 0.1400

Millimeters

Min.

Max.

6.29

6.40

9.22

9.32

-

*1.52

-

*1.27

-

*0.99

3.25

3.35

3.17

3.55

*: Typical

DIM

Inches

Min.

Max.

Millimeters

Min.

Max.

H 0.0150 0.0210 0.38

0.53

I

0.0898 0.1098 2.28

2.79

J 0.2950 0.3050 7.49

7.74

K

-

*0.1181

-

*3.00

L 0.3370 0.7470 8.56

8.81

M 0.0090 0.0150 0.229 0.381

α1

94°

97°

94°

97°

Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.

2.Controlling dimension: millimeters.

3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.

Material:

• Lead: 42 Alloy; solder plating

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0

H1563P / H1563S

HSMC Product Specification

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